Micron's HBM3E and SOCAMM Products Boost AI Server Performance, Partnering with NVIDIA

On Tuesday, Micron Technology, Inc. (NASDAQ:MU) disclosed that it is the first and only memory company to ship both HBM3E and SOCAMM (small outline compression attached memory module) products for AI servers in data centers.

Micron’s SOCAMM, a modular LPDDR5X memory solution developed in collaboration with NVIDIA, is designed to support the NVIDIA GB300 Grace Blackwell Ultra Superchip.

Additionally, Micron’s HBM3E 12H 36GB is integrated into the NVIDIA HGX B300 NVL16 and GB300 NVL72 platforms, while the HBM3E 8H 24GB is ...